chip design simulation

Chip design simulation for AI hardware.

A focused Anvil Sim surface for chip-package thermal, cooling, structural, electromagnetic, and coupled simulation. The first public evidence is thermal and electronics work; the product direction is a full review workflow for chip designers.

Review workflow →See evidence Open benchmarks

Package thermal

Power maps, package stackups, heat spreaders, boundary conditions, temperature QoIs, and heat-balance checks.

Cooling and fluid flow

Airflow, liquid channels, heat sinks, manifolds, fan boundaries, pressure drop, and grid-sensitivity comparisons.

Structural stress and warpage

Thermal gradients, package geometry, board constraints, material assumptions, stress fields, deformation, and modal checks.

Electromagnetic and PDN review

EM, IR-drop, power integrity, signal integrity, shielding, and reference-model comparisons with explicit QoIs.

Coupled chip-package workflows

Electro-thermal-mechanical loops where power changes temperature, temperature changes stress, and both affect design decisions.

workflow

Set up, run, debug, compare, explain.

The tab is organized around the work a chip designer actually needs to do. Each step leaves behind something reviewable.

Step	Question	Anvil action	Artifact
Set up	What chip/package case are we actually solving?	Bind geometry, stackup, materials, power map, cooling boundary, and target QoIs.	Runnable simulation plan
Run	Which physics domain answers the design question?	Run thermal, structural, fluid, electromagnetic, or coupled cases with visible solver evidence.	Fields, deltas, and logs
Debug	Why does the result look wrong?	Check units, mesh quality, material assumptions, boundary conditions, residuals, and convergence behavior.	Issue list and rerun plan
Compare	What should this result match?	Compare against analytic checks, public references, measured thermal data, or reference solvers when available.	QoI table and evidence row
Explain	What should an engineer do with the result?	Summarize assumptions, visual evidence, benchmark/reference deltas, and the next validation step.	Review packet

available evidence

Thermal and cooling first, then coupled chip workflows.

Current public artifacts cover electronics thermal airflow, heat-sink topology, and transient heat conduction. The chip tab shows how those pieces turn into a practical simulation workflow.

Electronics enclosure thermal airflow

ACTIVE REVIEW

Thermal-airflow / natural convection decision demo

Customer-facing electronics enclosure cooling clip with chimney-effect airflow, PCB temperature, heat-balance closure, and passive-cooling verdict tied to the thermal-airflow receipt.

evidence: Electronics thermal-airflow receipt

Heat-sink topology optimization

EVIDENCE READY

Thermal SIMP topology optimization

Thermal-SIMP density evolution from the live Rust snapshot API, with Bendsoe-Sigmund benchmark band, compliance trace, and optimized heat-channel layout.

evidence: Thermal-SIMP topology receipt

Transient heat conduction

ACTIVE REVIEW

Transient thermal (Tet10 conductivity)

Transient heat capture with an anvil-thermal solve, Carslaw-Jaeger analytic gate, and boundary-condition refinement next.

evidence: Transient heat-conduction receipt

chip benchmark rows

Numbers matter: QoI, evidence, next step.

Chip design simulation needs numbers: temperature, pressure drop, stress, deformation, electromagnetic loss, and coupled deltas.

Benchmark	Domain	QoI / tolerance	Status	Latest evidence	Next step
Transient heat conduction check	Thermal FEA	Temperature-time profile comparison exists with the boundary-condition model called out for refinement.	VALIDATION TRACK	Transient heat-conduction public clip and thermal receipt.	Replace fallback, rerun transient temperature QoIs, and publish tolerance deltas.
AI chip package thermal preview	Electronics / thermal	Junction/package temperature, heat-spreader assumptions, and airflow tolerances are the next evidence step.	INTAKE TARGET	Electronics thermal-airflow preview and heat-sink SIMP clip.	Select a public package/reference model, bind power and material assumptions, and publish temperature QoIs.
Electronics thermal-airflow preview	FEA / thermal / electronics	Thermal channel and heat-balance evidence are visible; conjugate heat-transfer tolerance is the next expansion path.	VALIDATION TRACK	Thermal-SIMP and electronics thermal-airflow public clips.	Add an external thermal reference or electronics module validation case with explicit temperature tolerances.